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Add heatsink and BGA pad property requirement

John Beard requested to merge johnbeard/klc:heatsink_pads into master

This adds the requirement for pad fabrication properties:

  • "Heatsink" on front, back copper and thermal vias in heatsink pads (e.g. exposed pad landings)
  • "BGA" for BGA ball landings

See also kicad-footprint-generator!1011 (merged), which adds these to the generators.

Merge request reports