Fix heatsink pads in generated ExposedPads (heatsink property and zone connections)
This commit series adds (type-safe) fabrication properties to the Pad
class, and appropriate serialisation to s-expr.
This is then used to:
- Address kicad-footprints#2634 - add 'heatsink' property to
ExposedPad
, which will be used by_SO
andQFN
generators - Address kicad-footprints#2564 (closed) - add 'bga' property to BGA pads in the BGA generator
Then, add zone connection settings to Pad
, and serialisation. Use this for:
- Making EPs have solid zone connections, which is more likely to be true on a thermal pad
This doesn't resolve the issue, as regeneration is also required, which will be a follow-up.
For heatsink pads, the property is applied to all pads: the two copper pads (front and back, if the back pad exists) and all thermal "vias" (which are also Pads
)
Attached some examples:
-
QFN with 'heatsink' pads:
-
BGA with 'bga' pads:
Suggested KLC update: klc!48 (closed)
Edited by John Beard