add Texas_BGA-289_15.0x15.0mm_Layout17x17_P0.8mm_Ball0.5mm_Pad0.4mm (generated footprint)
requested to merge armin.sch/kicad-footprints:Texas_BGA-289_15.0x15.0mm_Layout17x17_P0.8mm_Ball0.5mm_Pad0.4mm into master
Datasheet:
https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf
Pad size:
On request TI suggested a copper pad size of 0.4mm for this BGA package.
Screenshot:
Related MRs:
Edited by Armin Schoisswohl