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add Texas_BGA-289_15.0x15.0mm_Layout17x17_P0.8mm_Ball0.5mm_Pad0.4mm (generated footprint)

Datasheet:

https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf

ds

Pad size:

On request TI suggested a copper pad size of 0.4mm for this BGA package.

Screenshot:

fp

Related MRs:

Edited by Armin Schoisswohl

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