Nexperia WLCSP15: wafer level chip-size package; 15 bumps (6-3-6)
requested to merge armin.sch/kicad-footprints:Nexperia_WLCSP-15_6-3-6_2.37x1.17mm_Layout6x3_P0.4mm into master
Merge Requests:
- Footprint: kicad-footprint-generator!827 (merged)
- Symbol: kicad-symbols!3680 (merged)
Datasheet:
https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf page 17 and page 19.
Screenshot:
Edited by Armin Schoisswohl