Nexperia WLCSP15: wafer level chip-size package; 15 bumps (6-3-6)
Datasheet:
https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf pages 17 and 19.
Screenshot:
Related MRs:
- Footprint: kicad-footprints!2969 (merged)
- Symbol: kicad-symbols!3680 (merged)
Notes:
This MR requires the changes from !796 (merged) for describing sub-layouts.
Edited by Armin Schoisswohl