Diodes_SMD: Reduce amount of exposed copper on back pads
Created by: mrnuke
These footprints exposed rectangular pads on both front and copper layers. This is am issue when soldering SMD diodes, as a large amount of solder can be wicked to the back pads. A mountain of solder accumulates on the back pads.
To resolve this, only expose a circular pad on the back. The front still has rectangular pads, so the functionality of this footprint is not reduced.
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