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Diodes_SMD: Reduce amount of exposed copper on back pads

KiCad Bot requested to merge github/fork/mrnuke/fix-diode-universal into master

Created by: mrnuke

These footprints exposed rectangular pads on both front and copper layers. This is am issue when soldering SMD diodes, as a large amount of solder can be wicked to the back pads. A mountain of solder accumulates on the back pads.

To resolve this, only expose a circular pad on the back. The front still has rectangular pads, so the functionality of this footprint is not reduced.

Example of problem: kicad-wick

Proposed solution: new_foot

  • Provide a URL to a datasheet for the footprint(s) you are contributing
  • An example screenshot image is very helpful
  • If there are matching symbol or 3D model pull requests, provide link(s) as appropriate
  • Check the output of the Travis automated check scripts - fix any errors as required
  • Give a reason behind any intentional library convention rule violation.

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