Remove copper layer from paste (stencil) pads
Created by: SchrodingersGat
This PR fixes a bug I found in the Vishay PowerPak Single footprint.
The stencil pads do not have a number (which is correct) but they incorrectly have the front copper layer set. This prevents the footprint from being routed as the copper pads is un-numbered.
For this PR I have simply removed the copper layer.
I think this should be something that the KLC should be able to detect, probably have to implement a collision detection routine for copper shapes.