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Remove copper layer from paste (stencil) pads

KiCad Bot requested to merge github/fork/SchrodingersGat/powerpak-fix into master

Created by: SchrodingersGat

This PR fixes a bug I found in the Vishay PowerPak Single footprint.

The stencil pads do not have a number (which is correct) but they incorrectly have the front copper layer set. This prevents the footprint from being routed as the copper pads is un-numbered.

For this PR I have simply removed the copper layer.

I think this should be something that the KLC should be able to detect, probably have to implement a collision detection routine for copper shapes.

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