Assemble SIDLOC Transceiver for ERMINAZ mission
https://cloud.libre.space/s/YPx98NK26C3qPKf
PCB assembly report:https://gitlab.com/librespacefoundation/sidloc/sidloc-transceiver/-/releases/0.2-production-1
Release:Number of boards: 4
Pre-Assembly Action items:
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Check the condition of the stencil printer -
Check the condition of the reflow oven -
Check the condition of the pick and place -
Check the condition of the solder paste (the date that the solder paste was first opened is always recorded in the packing). Inspect if it is expired, if it has blobs or other foreign elements inside. -
Check the condition of glue for bottom layer of PCB. -
Get from the GitLab release (production or assembly tag) the iBOM (interactive BOM). -
Define the number of boards: 4 -
Define the name of assembly run: sidloc-trx-v0.2-erminaz-assembly -
Ensure that the procurement of the PCBs and EEE components is finished and everything is available at the lab. Order out-of-stock components. -
Short the EEE components of bottom layer according to iBOM and check the field. -
Short the EEE components of top layer according to iBOM and check the field. -
Ensure that the pick and place machine is properly grounded with the appropriate grounding pin.
Assembly Action items:
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Start with the bottom layer of the PCB -
Apply solder paste and start the time keeping device. -
Inspect the solder paste with a microscope and take a high resolution photo. -
Place PCB in the vice for pick and place -
The manual pick and place needs two people. One for assembly, one for inspection. When components are placed check the field. -
Evaluate the conditions and the time that the solder paste can be in the PCB. -
Place the PCB in the Reflow oven. -
Apply electronics glue in the bottom layer of PCB. -
Use a reflow oven to cure electronics glue according to the manual of it. Pay attention to not overcome the maximum storage temperature of each IC. -
Create a label with assembly run name. Use the label that produced from inventree build orders. -
Place the PCB inside an anti-static bag with above label. -
Store the anti-static bag in the Project storage. -
Update the inventory system, BO-0013, BO-0004 -
Update the PCB assembly report. -
Repeat steps for the other side of the board.
Post-Assembly Action items:
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Clean the PCB by using isopropyl alcohol, 99 % pure [RD-14] (section 6.4 Solvents). Do not use ultrasonic cleaner for PCB assemblies [RD-14] (section 11.2) -
Ensure that the table has a proper ESD protection mat. Check also that it is properly grounded. -
Ensure that an ESD bracelet is worn and that it is properly grounded. -
Label each assembled PCB with its serial number by following the labeling system of each project. -
Take a high resolution photo and inspect for: - Missing components. Use the iBOM (interactive BOM) from GitLab release as reference.
- Soldering defects.
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If needed, fix possible defects with the PCB rework station by following the guidelines from ECSS‐Q‐ST‐70‐28C [RD-15] chapter 4 (sections 4.2 - 4.4), log any rework as referred in the Traceability section. Pay attention to protect other ICs or passive parts near the issue. -
Inspect the board again by following the previous step. -
Update the PCB assembly report.
Edited by Agis Zisimatos