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Fixed PIC10 DFN-8 footprints

Patrick Baus requested to merge PatrickBaus/kicad-symbols:fix_PIC10 into master

This MR fixes the DFN-8 footprints of some of the PIC10 MCUs. The affected MCUs are from the PIC10F20x, the PIC10F22x and PIC10F32x series (https://ww1.microchip.com/downloads/en/DeviceDoc/40001239F.pdf):

  • PIC10F200-IMC
  • PIC10F202-IMC
  • PIC10F204-IMC
  • PIC10F206-IMC
  • PIC10F220-IMC
  • PIC10F222-IMC
  • PIC10F320-IMC
  • PIC10F322-IMC

The original footprint was Package_DFN_QFN:DFN-8-1EP_2x3mm_P0.5mm_EP0.61x2.2mm This footprint is 2x3mm, but it should be 3x2mm. I replaced the footprint with the correct Package_DFN_QFN:DFN-8-1EP_3x2mm_P0.5mm_EP1.7x1.4mm, which is already in the database. The confusion stems from the fact that Microchip defines the width and length differently.

I am aware that these symbol need some more love (size, pin offset, more derived symbols, etc), but I would like to keep this MR concise, so I only fixed the footprints.

Below is a screenshot from the datasheet of the PIC10 MCUs involved. I have highlighted both the Packaging code MC and the rotated dimensions by Microchip which caused the issue in the first place.

datasheet

The datasheet of the fixed Package_DFN_QFN:DFN-8-1EP_3x2mm_P0.5mm_EP1.7x1.4mm is indeed the correct one (MC) for this chip.

footprint


  • Remove the instructional content of this template
  • Provide a URL to a datasheet for the symbol(s) you are contributing
  • An example screenshot image is very helpful
  • Ensure that the associated footprints match the official footprint library
    • A new fitting footprint must be submitted if the library does not yet contain one.
  • If there are matching footprint PRs, provide link(s) as appropriate
  • Check the output of the automated check scripts - fix any errors as required
  • Give a reason behind any intentional library convention rule violation.

Be patient, we maintainers are volunteers with limited time and need to check your contribution against the datasheet. You can speed up the process by providing all the necessary information (see above). Providing a dimensioned drawing of your contribution can speed up the review process. More information on that can be found here:

Edited by Patrick Baus

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