General fixes for the PIC12 series

This MR has a few fixes for the PIC12 series of MCUs, in separate commits:

• Use HTTPS in all datasheet URLs (and place neatly while at it)
• DS for PIC12LF1840T48 updated to https://ww1.microchip.com/downloads/en/DeviceDoc/40001594C.pdf
• DS for PIC12x1822 updated to https://ww1.microchip.com/downloads/en/DeviceDoc/PIC12LF1822-16LF1823-Data-Sheet-40001413F.pdf
• Reset pin offsets to defaults, as these symbols don't have graphics that require non-default offsets (https://klc.kicad.org/symbol/s3/s3.6/)
• (Most important IMO): Use the correct footprints for every symbol that doesn't end in P: currently all the PIC12 parts are assigned the DIP-8 footprint, regardless of package code. Details below.
• Remove the temperature grade (I, industrial) from the part number and replace with x . PIC12s can also have E (extended) ratings. (per https://klc.kicad.org/symbol/s2/s2.2/)

I did not make any symbol changes here even though the box is pretty big. Doing that probably needs co-ordination with the rest of the PIC libs (or, better perhaps, script the PICs entirely). But at least it's not wrong.

One of very many examples:

Before	After

---

Footprint re-mappings

P - DIP-8

E.g. https://ww1.microchip.com/downloads/en/DeviceDoc/40001615C.pdf

This is correct for the -P packages and isn't changed:

• Package_DIP:DIP-8_W7.62mm
• Filter: DIP*W7.62mm*

SN - SOIC-8 narrow

• Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
• SOIC*3.9x4.9mm*

SM - SOIC-8W (wide)

• This is within tolerance for Package_SO:SOIC-8W_5.3x5.3mm_P1.27mm (see also kicad-footprint-generator!1018 (closed))
• SOIC*5.3x5.3mm*

JW - CERDIP-8

This appears to be virtually the same as a JEDEC MS-015 side-brazed CERDIP:

• While it's not windowed, this is physically compatible with the just-added Package_DIP:CERDIP-8_W7.62mm_SideBrazed ( kicad-footprints!3444 (merged))
  • Eventually, it would be better to have a windowed variant in the CERDIPs too for allowing 3D model accuracy, but that's a nice-to-have IMO
• CERDIP*7.62mm*SideBrazed*

MC - DFN-8 3x2mm

• https://ww1.microchip.com/downloads/en/DeviceDoc/40001615C.pdf

• EP size not well defined with a nominal size
• Use Package_DFN_QFN:DFN-8-1EP_3x2mm_P0.5mm_EP1.7x1.4mm , which meets the criteria of max. 1.45x1.75mm, though several other DFN-8 would also meet this part.
• DFN*1EP*3x32mm*P0.5mm*

MS - MSOP-8 3x3 body

• https://ww1.microchip.com/downloads/en/DeviceDoc/40001615C.pdf#page=279

• Package_SO:MSOP-8_3x3mm_P0.65mm
• MSOP*3x3mm*P0.65mm*

ST - TSSOP-14

• https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/40001594C.pdf#page=369

• Package_SO:TSSOP-14_4.4x5mm_P0.65mm
• TSSOP*4.4x5mm*P0.65mm*