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Added WLCSP-9_1.21x2.1.22mm_P0.4mm

Patrick Baus requested to merge PatrickBaus/kicad-packages3D:add_WLCSP-9 into master

This MR adds the ADI 9-Ball Wafer Level Chip Scale Package. This 3D model is required for the WLCSP-9_1.21x2.1.22mm_P0.4mm footprint in kicad-footprints!3573 (merged) and generated using the 3D model generator. An MR was opened at kicad-packages3D-generator!179 (merged).

All the details and images can be found with the 3D-model generator MR. The KiCad screenshot is repeated here:

WLCSP-9-3D

To speed up integration of your PR, please check the following items as you complete them:

  • A screenshot of the model(s) aligned with KiCad footprint(s)
  • Source files are contributed on the apropriate location
  • Step model submitted in 1:1 scale
  • WRL model submitted in 1:2.54 scale
  • 3D model alignment checked against KiCad footprint
  • WRL model uses correct material properties
  • Geometry check performed on the model

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