Added WLCSP-9_1.21x2.1.22mm_P0.4mm
This MR adds the ADI 9-Ball Wafer Level Chip Scale Package. This 3D model is required for the WLCSP-9_1.21x2.1.22mm_P0.4mm
footprint in kicad-footprints!3573 (merged) and generated using the 3D model generator. An MR was opened at kicad-packages3D-generator!179 (merged).
All the details and images can be found with the 3D-model generator MR. The KiCad screenshot is repeated here:
To speed up integration of your PR, please check the following items as you complete them:
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A screenshot of the model(s) aligned with KiCad footprint(s) -
Source files are contributed on the apropriate location - Link to the package3d-source pull request or to the script pull request
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Step model submitted in 1:1 scale -
WRL model submitted in 1:2.54 scale -
3D model alignment checked against KiCad footprint -
WRL model uses correct material properties -
Geometry check performed on the model