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add: SSOP-10-1EP_3.9x4.9mm_P1.0mm_EP2.1x3.3mm

HalfSweet requested to merge HalfSweet1/kicad-packages3D:SSOP-10-1EP into master

A variant of the SSOP-10 package with a thermal pad.

It may also be called ESSOP by some chip makers, but the parameters are the same except for the name.

Some datasheets using this chip:

kicad-footprints: kicad-footprints!3633 (merged)

kicad-packages3D-generator: kicad-packages3D-generator!202 (merged)

kicad-footprint-generator: kicad-footprint-generator!1114 (merged)

图片

图片

Edited by HalfSweet

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