Added TQFP-52 with exposed pad footprint for AD6645
TQFP-52 footprints generated by script with following package parameters:
TQFP-52-1EP_10x10mm_P0.65mm_EP6.5x6.5mm:
device_type: 'TQFP'
size_source: 'http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_52_1.pdf'
body_size_x:
nominal: 10
tolerance: 0
body_size_y:
nominal: 10
tolerance: 0
overall_size_x:
nominal: 12
tolerance: 0
overall_size_y:
nominal: 12
tolerance: 0
lead_width_min: 0.22
lead_width_max: 0.38
lead_len_min: 0.45
lead_len_max: 0.75
pitch: 0.65
num_pins_x: 13
num_pins_y: 13
EP_size_x:
minimum: 6.4
nominal: 6.5
maximum: 6.6
EP_size_y:
minimum: 6.4
nominal: 6.5
maximum: 6.6
EP_paste_coverage: 0.65
EP_num_paste_pads: [5, 5]
#heel_reduction: 0.1 #for relatively large EP pads (increase clearance)
# EP_size_limit_x: 3.6 #for relatively large EP pads (increase clearance)
# EP_size_limit_y: 3.6 #for relatively large EP pads (increase clearance)
thermal_vias:
count: [4, 4]
drill: 0.2
# min_annular_ring: 0.15
paste_via_clearance: 0.1
# EP_num_paste_pads: [2, 2]
#paste_between_vias: 1
#paste_rings_outside: 1
#EP_paste_coverage: 0.65
#grid: [1, 1]
# bottom_pad_size:
# paste_avoid_via: True
Thanks for creating a pull request to contribute to the KiCad libraries! To speed up integration of your PR, please check the following items:
-
Provide a URL to a datasheet for the footprint(s) you are contributing http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_52_1.pdf -
An example screenshot image is very helpful With thermal vias Without thermal vias -
If there are matching symbol or 3D model pull requests, provide link(s) as appropriate -
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