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LTC Legacy MSOP-16 footprints

KiCad Bot requested to merge github/fork/daab4848/daabranch_footlibs_addendums into master

Created by: daab4848

Pull Request Details Part Name: LTC-Legacy_MSOP-16_3x4mm_P0.5mm Part Manufacturer: Linear Technology Datasheet URL: http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081669_A_MS16.pdf Current Footprint Library: Package_SO Associated Symbol(s) and/or PR(s): - Footprint Screenshot: image

Part Name: LTC-Legacy_MSOP-16-1EP_3x4mm_P0.5mm_EP1.65x2.85mm Part Manufacturer: Linear Technology Datasheet URL: http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081667_F_MSE16.pdf Current Footprint Library: Package_SO Associated Symbol(s) and/or PR(s): - Footprint Screenshot: image

Part Name: LTC-Legacy_MSOP-16-1EP_3x4mm_P0.5mm_EP1.65x2.85mm_ThermalVias Part Manufacturer: Linear Technology Datasheet URL: http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081667_F_MSE16.pdf Current Footprint Library: Package_SO Associated Symbol(s) and/or PR(s): - Footprint Screenshot: image

Additional Comments and/or Questions *Though there are other MSOP-16 footprints, I've found the SMD pads to be far too long and the silkscreen to be unnecessarily large/unconcise/less-fitting to the contours of MSOP-16 dimensions (even when considering the nominal+max. tolerance of the footprint dimensions). Thus, this makes the courtyard unnecessarily large and the current MSOP-16 footprints do not correctly accommodate the LT/LTC parts which use these footprints.
*Since Analog Devices acquired Linear Technology and some LT/LTC parts still use the MSOP-16 packages (non-EP and EP versions), Analog Devices has thus maintained these footprint drawings and have categorized them under "LTC Legacy". See http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/package-index/sop-small-outline-package/ltc-legacy-msop.html for details. *Please advise on the solder paste of the _ThermalVias version of the MSOP-16 package. *Please also advise on the thermal pad size and via placement. I tried my best to accommodate KiCad's library convention rule F4.4 about giving >=0.5mm margin around vias so the size of the thermal pad in the _ThermalVias version is slightly larger than the regular EP version.

Thanks for creating a pull request to contribute to the KiCad libraries! To speed up integration of your PR, please check the following items:

  • Provide a URL to a datasheet for the footprint(s) you are contributing
  • An example screenshot image is very helpful
  • If there are matching symbol or 3D model pull requests, provide link(s) as appropriate
  • Check the output of the Travis automated check scripts - fix any errors as required
Edited by Joel Guittet

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