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WSON-10: Remove mask over thermal vias

evanshultz requested to merge github/fork/evanshultz/wson10 into master

The 3 vias on this footprint created a KLC violation. I noted this when the footprints were moved to this repo and am now fixing it. The actual PCB wouldn't change due to this, since a big central pad with mask already exists, but it fixes the KLC violation and doesn't hurt. See page 32 of the datasheet at http://www.ti.com/lit/ds/symlink/tps62177.pdf.

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