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add: Winbond_USON-8-1EP_3x2mm_P0.5mm_EP0.2x1.6mm

HalfSweet requested to merge HalfSweet1/kicad-footprints:USON-8 into master

This is a common USON-8 package for winbond, I don't see it being used by other vendors at the moment, so I've added the Winbond prefix.

datasheet: https://www.lcsc.com/datasheet/lcsc_datasheet_2205122030_Winbond-Elec-W25Q16JVUXIQ_C2843335.pdf#page=67

图片 图片

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