Added Vishay PowerPAK 8 x 8L footprint/Nexperia LFPAK88
This is a MR for the Nexperia LFPAK88. The Vishay PowerPAK 8 x 8L (not to be confused with the existing and smaller PowerPAK_SO-8L_Single or PowerPAK_SO-8L_Single) is a similar/compatible package. It required for the symbol submitted in kicad-symbols!4194 (merged).
Summary:
- Symbol: kicad-symbols!4194 (merged)
- 3D Model: kicad-packages3D!945 (merged)
- 3D Model source: kicad-packages3D-generator!132 (merged)
- Dimensions see below
- Violates KLC F6.2, because the footprint is centered with regard of the plastic package as shown in the package outline (see section Nexperia LFPAK88 below)
- Triggers KLC F6.3, because the test does not work well with non-rectangular pads
Basic footprint image
I have modeled the footprint shown above after the Nexperia LFPAK88 and subsequently also tested it with a Vishay SQJQ160E, which comes in a PowerPAK 8 x 8L package. The reason for this is twofold. First, I think Nexperia pioneered the LFPAK package 20 years ago and second Vishay markets two different packages under the name PowerPAK 8 x 8L. There is the original PowerPAK 8 x 8L package and its recommended footprint. The older package is used for the automotive SQJQ4xxEx series found here and the SiJH440E found here.
Original PowerPAK 8 x 8L Single
The original PowerPAK 8 x 8L is 1.8 mm high and features metal protrusions on each side. The newer package is the PowerPAK 8 x 8L BWL also marketed as PowerPAK 8 x 8L with no distinction made in the datasheet. It is slightly thinner at 1.6 mm height and does not have the metal protrusion.
New PowerPAK 8 x 8L BWL
The new PowerPAK 8 x 8L BWL is also very similar to the Nexperia LFPAK88 package including its footprint.
Nexperia LFPAK88
In order to avoid needless confusion about the Vishay package(s) I decided to use the Nexperia LFPAK88 designator for this footprint. Additionally the Nexperia footprint guidelines provide a lot more details like the solder paste layer. So here it goes:
