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Added 0.3mm via drill variants for ESP32 modules

Uli Köhler requested to merge ulikoehler/kicad-footprints:ESP32-Drill into master

Currently, the ESP32 modules use thermal vias in the center GND pad with 0.6mm ring / 0.2mm drill. However, many PCB manufacturers allow only 0.3mm+ vias to be drilled - especially for 2-layer PCBs - with JLCPCB being a notable example.

This is a proposal to add 0.3mm drill footprint variants for all ESP32 modules. In this pull request, I added them for the ESP32S3 modules only, but once there is some feedback from maintainers on this, I'll add the remaining footprints.

There is some argument to be made about 0.3mm vias wicking away to much solder from the pad, but this is why I argue it would be best to keep both variants:

  • 0.2mm drills for designed who would prefer
  • 0.3mm drills for all projects where time & cost of manufacturing is more important than supposedly slightly better thermal conductivity to the center pad

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