Add Maxim_TDFN-12-1EP_3x3mm_P0.5mm_EP1.7x2.5mm.kicad_mod footprint
Addition of Maxim (Analog Devices) TDFN-12 package, 3x3mm, 0.5mm pitch, 2.5x1.7mm pad.
Derived from DFN-12-1EP_3x3mm_P0.5mm_EP1.6x2.5mm
footprint with following changes:
- Size of pads
- X co-ordinate of pads
- Size of exposed pad
- 3D model path changed to STEP
See also MR for MAX2220x symbols using this footprint
KLC check footprint script output:
Violating EC02 - (extended check)
Pad shape checks
Rectangular SMD pad
- Pads 13 are square. If possible, change to round-rect.
Violating F6.3 - https://klc.kicad.org/footprint/f6/f6.3/
Pad requirements for SMD footprints
Pad(s) potentially missing layers
- Pad '13' missing layer 'Paste'
Violating F9.3 - https://klc.kicad.org/footprint/f9/f9.3/
Footprint 3D model requirements
3D model name is different from footprint name (found 'DFN-12-1EP_3x3mm_P0.5mm_EP2.05x2.86mm', expected 'Maxim_TDFN-12-1EP_3x3mm_P0.5mm_EP1.7x2.5mm')
- EC02 I am not sure if the current requirement is for rectangle or rounded rectangle exposed pads. The all the exposed pads of other DFN parts in the library have non-rounded corners so I have done the same for consistency.
- F6.3 Paste apertures are handled as seperate pads for the exposed pad
- F9.3 Existing 3D model is correct with exception of exposed pad size