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Adding HVSSOP-8 footprint

Adding HVSSOP-8 footprint to support TPA6110A2 symbol I've also submitted as a merge request to the symbol library. I generated the footprint using the ipc_gullwing_generator script. The checker script throws a warning about missing paste layers for the thermal pad, but the footprint includes separate paste for that region.

Datasheet: https://www.ti.com/lit/ds/symlink/tpa6110a2.pdf

More info about the footprint:

https://www.ti.com/lit/an/sloa120/sloa120.pdf?ts=1645759077529&ref_url=https%253A%252F%252Fwww.google.com%252F

https://www.ti.com/lit/an/slma002h/slma002h.pdf?ts=1645703047353&ref_url=https%253A%252F%252Fwww.google.com%252F

Application note confirming the pad is connected to the ground pin: https://www.ti.com/lit/ug/slou085/slou085.pdf

Edited by Justin Trzeciak

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