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RF_Module: Fix and improves HOPERF_RFM9XW_SMD footprint

Changes F.Fab thickness from 0.12 to 0.1 mm; Changes F.Silk thickness from 0.10 to 0.12 mm; Improves F.Silk drawing, including pin 1 indication; Fixes F.CrtYd clearance to 0.25mm;

Before screenshot_2018-12-24_15-44-28

After screenshot_2018-12-24_15-43-44


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  • Provide a URL to a datasheet for the footprint(s) you are contributing
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