Bga xilinx zynq 7

Created by: dlharmon

PR #238 should be merged first. It expands the number of rows supported from 20 to 60 and is required for the packages over 400 balls.

Package docs from Xilinx

Additional doc from Xilinx

kicad-footprints PR

CLG225 image

Other parts are similar.

Concerns

Duplication of existing parts

Some of these are close to existing parts in the library and should probably be removed from the branch before merging.

• CLG225/BGA-225_13x13mm_Layout15x15_P0.8mm_Ball0.4mm_Pad0.4mm_NSMD is unique
• CLG400/BGA-400_17x17mm_Layout20x20_P0.8mm_Ball0.5mm_Pad0.4mm_NSMD is unique
• CLG484/BGA-484_19x19mm_Layout22x22_P0.8mm_Ball0.5mm_Pad0.4mm_NSMD is unique
• FBG484/BGA-484_23x23mm_Layout22x22_P1.0mm_Ball0.6mm_Pad0.53mm_NSMD is similar to the existing BGA-484_23.0x23.0mm_Layout22x22_P1.0mm and FB-BGA-484_23.0x23.0mm_Layout22x22_P1.0mm
• FBG676/BGA-676_27.0x27.0mm_Layout26x26_P1.0mm_Ball0.6mm_Pad0.5mm_NSMD is similar to the existing BGA-676_27.0x27.0mm_Layout26x26_P1.0mm_Ball0.6mm_Pad0.5mm_NSMD
• FFG900/BGA-900_31x31mm_Layout30x30_P1.0mm_Ball0.6mm_Pad0.53mm_NSMD is unique
• FFG1156/BGA-1156_35x35mm_Layout34x34_P1.0mm_Ball0.6mm_Pad0.53mm_NSMD is similrar to BGA-1156_35.0x35.0mm_Layout34x34_P1.0mm

Naming

• should these include the Xilinx designator (CLG225, CLG400, etc) in the name?
• FBG676, FFG676 and RF676 all have the same dimensions on the bottom side. They differ on the top side with a heat spreader vs exposed die. Should these be separate footprints for the sake of attaching 3D models later. The same is true of CLG484 and SBG485.
• 17x17mm vs 17.0x17.0mm - which is correct? The library has a mix and I wasn't even consistent within this PR. I'll fix this before the merge.

Pad size

• UG865 gives a maximum pad size only (0.4 mm for 0.8 mm pitch and 0.53 mm for 1.0 mm pitch) and that's what I have for now.
• UG1099 gives a pad size of 0.4 mm for FB and FT devices (1.0 mm pitch), 0.51 mm for FF, FG, other 1.0 mm pitch devices. On 0.8 mm pitch, it is consistent with UG865, calling for an 0.4 mm pad. There is no difference in ball size for these packages (all have 0.6 mm balls).
• UG1099 also calls for a solder mask expansion of 0.015 mm which is outside of most design rules. I've used the UG865 value of 0.05 mm which is possible at most fabs.

should there be a more explicit pin 1 marker like others in the Kicad libs?

Example: