Add OnSemi ODCSP36 SiPM BGA package
Requires manual modification Adds a normal variant according to manufacturer footprint recommendations, and a manual assembly variant with pads (and paste mask opening) as large as the MFR recommended solder mask opening (0.47 instead of 0.27mm - SM opening also 0.47mm)
Part datasheet https://www.onsemi.com/pdf/datasheet/microj-series-d.pdf
Footprint datasheet: https://www.onsemi.com/pub/Collateral/570CP.PDF
Edited by Uli Köhler