[Feature Request] Parametric Homeplate Solderpaste Apertures
Description
There are multiple common designs for solder paste apertures to decrease solder ball creation. When an 0402 or larger part is placed on a regular square aperture it can squeeze solder paste under the part, which results in small solder balls in the middle of the part. This can be a problem for no-clean process. The aperture modifications can sometimes be added by the stencil manufacturer but having control over them as the designer of the board can be very benefitial.
Here is a picture showing some common aperture designs:
It would be great if we could set the designs for the apertures in a similar way we can currently set solder mask clearances with different levels of global/local relevance. Even having this just apply to a pad itself would be very useful. Not having to create custom footprints for common parts would be nice though.
KiCad Version
Application: KiCad PCB Editor arm64 on arm64
Version: 8.0.1-rc1, release build
Libraries:
wxWidgets 3.2.4
FreeType 2.13.2
HarfBuzz 8.3.0
FontConfig 2.15.0
libcurl/8.4.0 (SecureTransport) LibreSSL/3.3.6 zlib/1.2.12 nghttp2/1.55.1
Platform: macOS Sonoma Version 14.2.1 (Build 23C71), 64 bit, Little endian, wxMac
Build Info:
Date: Mar 3 2024 23:26:20
wxWidgets: 3.2.4 (wchar_t,wx containers)
Boost: 1.84.0
OCC: 7.7.2
Curl: 7.87.0
ngspice: 42
Compiler: Clang 14.0.3 with C++ ABI 1002
Build settings: