Interconnection Basics.md

@@ -26,6 +26,7 @@ Ontario Institute of Technology.
         -   SMT components: 315 degree C (600 F)
         -   TH components: 370 degree C (700 F)
     3.  Wait for rod temperature to reach the set value
+
 1. Applying solder/flux
     1.  Solder
         -   Solder wire should be placed between terminal and soldering rod
@@ -44,7 +45,7 @@ Ontario Institute of Technology.
             its efficacy.
         -   External flux (paste, liquid)
         -   Inside solder wire (rosen)
-1.4. Timing / Sequence
+1 Timing / Sequence
     1.  Sequence:
         1.  Bring terminal of component to PCB pad
         2.  Bring soldering lead + rod
@@ -53,9 +54,7 @@ Ontario Institute of Technology.
     2.  Removing lead after removing rod leads to ‘whiskers’ or even lead
         stuck to board.
     3.  Heating for too long can damage component as well as PCB pads
-
-1.5. Mechanical
-
+1 Mechanical
     1.  Do not apply pressure on the rod with your hand
         -   A good solder joint happens because of temperature not force
         -   e.g. broken rod in our lab
@@ -63,9 +62,7 @@ Ontario Institute of Technology.
         -   Need to buy
     3.  Hot melt glue for mechanical strength.
         -   Where is our glue gun?
-
-1.6. Safety
-
+1 Safety
     1.  Personal
         -   Eye protection
             -   Splattering solder
@@ -80,9 +77,7 @@ Ontario Institute of Technology.
         -   Prefer desoldering wick over desol pump
 
 ## Wiring and connectors
-2.1. Wiring
------------
-
+1. Wiring
     1.  Selection of wire
         -   Gauges based on max current
         -   Insulation types
@@ -98,10 +93,7 @@ Ontario Institute of Technology.
             -   Ziptie holders
         -   Avoid loose connections e.g. wire in hole.
         -   Heat shrink sleeves vs insulation tapes
-
-2.2. Connectors
----------------
-
+2. Connectors
     1.  Start of every project
     2.  Weakest link; Cause of most common problems
     3.  Selection of connector