Schematic Review (Summary)
- Termination on CAN bus is optional for each node. If R1 & R2 are to be placed/removed to configure the Termination, please use a jumper. There is a solder jumper in Kicad. Schematic should contain at least a textual node if the termination is optional.
- SN65HVD230 is not CAN FD capable transceiver. Is MCP2518 downwards-compatible? Is there a footprint-compatible alternative?
- Overlapping text in schematic, e.g. at C2, C4
- Color of LEDs D1 and D2 unspecified.
- 0R Resistors are likely there to configure the stack's pinout. Please add an explanation in the schematic about their function and intend use.
- Crystal can is HC18, that is a huge packagem likely to cause an collision at assembly. Consider some SMD, like 3.2x2.5 mm.
- The mounting holes have unconnected pads.
- From the mechanical side the pad has no function, it can only create small metal debris when making contact with the screws thead at assembly, due to the through plating in the hole.
- For thermal conduction use something more elaborate is recommended.
- The schematic shall specify if the pads are electrically unconnected for a purpose or fix.
- If direct connection to Gnd is a strategy considered, it should be decided on system level.
Unchecked:
- I/F between mcp2518 and rpi.
- Symbols, pinouts etc.
- Supporting circuitry of mcp2518 and SN65HVD230