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- Merged
- 3
updated -
Add DFN-6-1EP_2x2mm_P0.5mm_EP0.6x1.37mm 3 of 3 checklist items completedupdated
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Added bevel to corner of package on FAB layer. Bevel is 1mm. (1.414mm… 1 of 5 checklist items completed
- Merged
- 2
updated -
Add LFCSP-16 1.3x1.3mm EP 2 of 5 checklist items completed
- Merged
- 1
updated -
- Merged
- 11
updated -
- Merged
- 2
updated -
Package SO: Create HTTSOP package for TPS2663xPWP 3 of 5 checklist items completed
- Merged
- 2
updated -
Added WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm (script generated) 3 of 5 checklist items completed
- Merged
- 1
updated -
Add Analog LFCSP-WD-8 5 of 5 checklist items completed
- Merged
- 3
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Added TDFN 10 Package with Exposed pad 5 of 5 checklist items completed
- Merged
- 6
updated -
updated
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- Merged
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- 1
updated -
Fix F.Paste of SIMCom SIM800C 5 of 5 checklist items completed
- Merged
- 5
updated -
Added Bourns SRU8028 SMD inductor. 5 of 5 checklist items completed
- Merged
- 1
updated -
Add Kemet Ex2 Series Mechanical Relays 3 of 5 checklist items completed
- Merged
- 19
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Added modified HTSSOP footprint for EP size for MAX482x ICs 0 of 1 checklist item completed
- Merged
- 5
updated -
Connector JAE: Add Nano SIM Card SF72S006 3 of 5 checklist items completed
- Merged
- 10
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Added WQFN-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm 2 of 5 checklist items completed
- Merged
- 1
updated -
Fix ublox_NEO footprint missing paste on VCC pad 23 2 of 5 checklist items completed
- Merged
- 12
updated -
Mini-Circuits footprint HQ1157 5 of 5 checklist items completed
- Merged
- 2
updated