RFC: Rounded rectangle pads
As IPC suggests to use rounded rectangle pads i looked into what type of footprints are viable to convert. In future we might also want to codify it in the KLC.
One good example are the two terminal smd footprints (resistor, capacitor, ...) For these it helps with allowing more footprints to have silk screen in addition to the original benefits of having rounded rectangle pads.
Other easily convertible footprints are the scripted smd connector footprints.
I hit a roadblock however with the qfn footprints. Especially with the ones that would require the corner pads to be chamfered. As these chamfered pads are in reality polygon pads it means that they can not have rounded corners. (at least not with the current implementation of custom pads.) Now the question arises what to do with the remaining pads. Does it make sense to round them of anyways?
Another example where i am unsure are the exposed pads. I would assume they should be rounded as well. (But then again i am unsure as the paste stencil which is the main reason for rounding them is managed by separate pads anyways.)