Too many footprints in several libs
@poeschlr @jkriege2 @Ratfink @Misca1234 KLC says we should only have 250 footprints or symbols in a lib. Some of our footprint libs are exceeding this number.
I do notice with all current libs that invoking all footprint libraries (in Pcbnew or footprint editor) does take quite a while. I'm not sure if splitting them up would really help this, but when loading only a single library's footprints it should help. (Loading all libs in Eeschema or CvPcb takes an annoyingly long time as well, but this is about footprints.)
The exact qty of footprints changes nearly daily, but as of right now here are some libs that have 250 (or nearly that many) footprints:
- Capacitor_THT: 357 (split by axial, radial, disc, etc.?)
- Connector_JST: 426 (split by part family?)
- Connector_Molex: 582
- Connector_Phoenix_MC: 247 (close enough; split by horiz and vert?)
- Connector_Phoenix_MSTB: 269
- Connector_PinHeader*: 278
- Connector_PinSocket_1.27mm and bigger size: 247 or 279 (1.0mm is only 157)
- Connector_Samtec: 436
- Inductor_THT: 241
- Package_DIP: 233
And here are two things which I noticed when looking at this as well:
- Package_DFN_QFN: 170 (maybe split DFN and QFN since they are distinct package types?)
- SOT is, I believe, only an SMT package. So does it make sense to have Package_TO_SOT_THT (there are no SOT footprints in there)? Should it just be Package_TO_THT? And then would it make sense to split Package_TO_SOT_SMD into Package_SOT_SMD and Package_TO_SMD (resulting in 3 total libs)? Or break those two existing libraries differently into Package_SOT and Package_TO?
Edited by Daniel Giesbrecht