Infineon_PG-HSOF-8-1 missing f.Paste for pad 3
Footprint for the Infineon_PG-HSOF-8-1 in Package_TO_SOT_SMD is missing the Front-Paste for the pad number 3. The footprint Infineon_PG_HSOF-8-1_ThermalVias has the correct F.Paste layer.
If nobody else can correct this I can submit a pull request with the correction.