KiCad PCB fails thermals on complex pad stacks (lp:#1605049)
Original report created by PCB Wiz (1-pcb-wiz)
Bug: For simple PADS stacks KiCad creates Thermals all ok, BUT if I define
DIFFERENT Stacks aka sizes/shapes on F.Cu from B.Cu, like this
(pad 1 thru_hole rect (at 0 0) (size 1.7272 1.7272) (drill 1.016) (layers
F.Cu F.Mask)
(net 7 GND))
(pad 1 smd roundrect (at 0 0 22) (size 1.6 1.6) (layers B.Cu B.Mask)
(roundrect_rratio 0.1)
(net 7 GND))
Such stacks are common when allowing more channel space on non-solder side,
and also with translation from other CAD tools.
Then, the first (mounted side) Stack thermally connects OK, however second
stack tries, but comes up short.
If I ask for Solid (no thermal), it also gets confused on the more complex
Pad Stack, & gives a round cutout for a rounded rect pad on non-mounted
side ?!.
Also, that variable Stack gives a false/unwanted DRC report, like
ErrType(25): Hole near pad
@ (179.070 mm,104.140 mm): Pad 1 on F.Cu, Non-copper of J2
@ (179.070 mm,104.140 mm): Pad 1 on B.Cu, Non-copper of J2
To me it is preferable to have _one_ stack define the Drill/Slot+Top, as
that is easier to edit later.
That means the DRC should tolerate a hole/Slot thought a SMD pad of the
SAME Part.PinNum
Tested using
Application: kicad
Version: (2016-06-19 BZR 6943, Git e27f90a)-product, release build
Libraries: wxWidgets 3.0.2
libcurl/7.46.0 OpenSSL/1.0.2d zlib/1.2.8 libidn/1.32
libssh2/1.6.0 librtmp/2.3
Platform: Windows 8 (build 9200), 64-bit edition, 64 bit, Little endian,
wxMSW
See also pictures here
https://forum.kicad.info/t/stunted-thermals/3510
Original tags: pcbnew