PCBNEW: Inconsistent generation of solder mask when exporting to STEP file
Description
For some artifacts, there is solder mask in places where it should be keyed. Test_Mask.zip
PCB Editor:
3D Viewer - Correct display:
Generated and displayed STEP file:
Filled Circle - Okay
Filled Rectangle - Okay
Non Copper Zone - Wrong, the mask is over the zone
SMD Pad - Wrong, the mask is over the pad shape
THT Pad - Wrong, the mask is over the pad diameter. Okay, the mask is not through the hole
Vias - Wrong, the mask goes through the hole
Steps to reproduce
- Open PCB File
- File -> Export -> STEP
- Board Options: Check mark: Export board body, Cut vias board body, Export silkscreen, Export soldermask
- Export
KiCad Version
Application: KiCad x64 on x64
Version: 9.0.1-rc2, release build
Libraries:
wxWidgets 3.2.6
FreeType 2.13.3
HarfBuzz 10.2.0
FontConfig 2.15.0
Platform: Windows 10 (build 19045), 64-bit edition, 64 bit, Little endian, wxMSW
wxWidgets: 3.2.6 (wchar_t,wx containers)
Boost: 1.86.0
OCC: 7.8.1
Curl: 8.11.1-DEV
ngspice: 44
Compiler: Visual C++ 1942 without C++ ABI
KICAD_IPC_API=ON
Locale:
Lang: en_GB
Enc: UTF-8
Num: 1,234.5
Encoded кΩ丈: D0BACEA9E4B888 (sys), D0BACEA9E4B888 (utf8)