SMD footprints with thermal vias produce DRC errors, expecting through hole component type

Description

If the footprint of a pure SMD component is changed to the version that carries thermal vias, a DRC error is raised asking for the "wrong" component type.

Screenshot_2023-01-05_at_15.21.23

Attached is a minimal example with no other errors.

Untitled.zip

KiCad Version

Application: KiCad PCB Editor

Version: (6.0.10-0), release build

Libraries:
	wxWidgets 3.1.5

Platform: macOS Version 13.1 (Build 22C65), 64 bit, Little endian, wxMac

	wxWidgets: 3.1.5 (wchar_t,wx containers)
	Boost: 1.80.0
	OCC: 7.6.3
	Curl: 7.64.1
	ngspice: 38
	Compiler: Clang 12.0.0 with C++ ABI 1002

Build settings:
	KICAD_USE_OCC=ON
	KICAD_SPICE=ON