Merged requested to merge add-layer-to-chip into master
This MR adds the layer field to the CHIP header as described in BIP 123
On March 2nd I had a discussion with Leandrodimarco during which it was requested that Technical CHIPs include the layer field in their header as described in BIP 123. The spec has been included directly in the guidelines document for ease of reference
We are looking for feedback on whether or not this type should be added.