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Add layer field to chip header as described in BIP 123

Griffith requested to merge add-layer-to-chip into master

This MR adds the layer field to the CHIP header as described in BIP 123

On March 2nd I had a discussion with Leandrodimarco during which it was requested that Technical CHIPs include the layer field in their header as described in BIP 123. The spec has been included directly in the guidelines document for ease of reference

We are looking for feedback on whether or not this type should be added.

Edited by Griffith

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